Hot-selling co-packaged photonics original product

Lumentum's 200G-per-lane EML lasers and Intel's fully integrated optical compute interconnect (OCI) chiplets are among the hottest co-packaged photonics products in 2026.Leading Products and Technologies

1. Lumentum 200G EML Lasers Lumentum is currently the dominant supplier of 200G electro-absorption modulated lasers (EMLs), critical for next-generation 1.6T pluggable transceivers. These lasers are in high demand due to AI data center expansion, with NVIDIA pre-allocating capacity and lead times extending past 2027. Lumentum's EMLs are noted for high power, low latency, and compatibility with co-packaged optics (CPO) systems, making them a top-selling original product in the photonics market . 2. Intel Optical Compute Interconnect (OCI) Chiplets Intel has demonstrated the first fully integrated optical I/O chiplet co-packaged with a CPU, enabling 64 channels at 32 Gbps per direction over 100 meters of fiber. This product addresses AI infrastructure needs for higher bandwidth, lower power consumption, and longer reach, making it a key innovation in co-packaged photonics . 3. Broadcom Co-Packaged Optics (CPO) Modules Broadcom's CPO solutions integrate optics and silicon on a single substrate, offering high bandwidth density and power efficiency. These modules are widely adopted in AI and HPC data centers, supporting multi-terabit interconnects while reducing energy consumption . 4. Coherent and Other Optical Component Leaders Coherent, Mitsubishi, Sumitomo, and Applied Optoelectronics supply high-speed lasers, modulators, and photonic semiconductors for CPO systems. Coherent and Lumentum are the largest pure-play optical component companies with deep silicon photonics exposure, making their products highly sought after .

Market Trends Driving Sales

• AI Data Center Growth: The surge in AI workloads is driving demand for high-bandwidth, low-latency optical interconnects.
• Power Efficiency: CPO reduces energy consumption by placing optical engines adjacent to ASICs or XPUs, lowering link power from 30 W to 9 W in some 1.6T networks .
• Supply Constraints: Limited suppliers of high-performance EMLs and co-packaged lasers have created shortages and price increases, boosting the market value of original products .
• Integration Innovations: Advances in photonic integrated circuits (PICs), micro ring resonators, and phase-change materials enhance energy efficiency and scalability for AI and HPC applications .

Summary

For 2026, the hottest co-packaged photonics products include:

• Lumentum 200G EML lasers – high-volume, high-demand lasers for AI data centers.
• Intel OCI chiplets – fully integrated optical I/O solutions co-packaged with CPUs.
• Broadcom CPO modules – high-density, energy-efficient optical interconnects.
• Coherent and Applied Optoelectronics components – critical lasers and modulators for next-gen optical systems. These products are driving the rapid growth of the co-packaged photonics market, projected to expand from $2.4B in 2023 to $5.9B by 2029, fueled by AI infrastructure and high-performance computing demands .